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Treaty on Intellectual Property in respect of Integrated Circuits (Washington, 26 May 1989)
Article 1 - Establishment of a Union
Article 2 - Definitions
Article 3 - The subject matter of the Treaty
Article 4 - The legal form of the protection
Article 5 - National treatment
Article 6 - The scope of the protection
Article 7 - Exploitation; registration, disclosure
Article 8 - The duration of the protection
Article 9 - Assembly
Article 10 - International Bureau
Article 11 - Amendment of certain provisions of the Treaty
Article 12 - Safeguard of Paris and Berne Conventions
Article 13 - Reservations
Article 14 - Settlement of disputes
Article 15 - Becoming party to the Treaty
Article 16 - Entry into force of the Treaty
Article 17 - Denunciation of the Treaty
Article 18 - Texts of the Treaty
Article 19 - Depositary
Article 20 - Signature
Metadata
SiSU Metadata, document information
Manifest
SiSU Manifest, alternative outputs etc.
Treaty on Intellectual Property in respect of Integrated Circuits (Washington, 26 May 1989)
Multilateral
copy @ Lex Mercatoria
(1) [Eligibility]
(a) Any State member of the World Intellectual Property Organization or of the United Nations may become party to this Treaty.
(b) Any Intergovernmental Organization which meets the requirements of Article 2(x) may become party to this Treaty. The Organization shall inform the Director General of its competence, and any subsequent changes in its competence, with respect to the matters governed by this Treaty. The Organization and its member States may, without, however, any derogation from the obligations under this Treaty, decide on their respective responsibilities for the performance of their obligations under this Treaty.
(2) [Adherence]
A State or Intergovernmental Organization shall become party to this Treaty by:
(i) signature followed by the deposit of an instrument of ratification, acceptance or approval, or
(ii) the deposit of an instrument of accession.
(3) [Deposit of Instruments]
The instruments referred to in paragraph (2) shall be deposited with the Director General.
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