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Treaty on Intellectual Property in respect of Integrated Circuits (Washington, 26 May 1989)
Article 1 - Establishment of a Union
Article 2 - Definitions
Article 3 - The subject matter of the Treaty
Article 4 - The legal form of the protection
Article 5 - National treatment
Article 6 - The scope of the protection
Article 7 - Exploitation; registration, disclosure
Article 8 - The duration of the protection
Article 9 - Assembly
Article 10 - International Bureau
Article 11 - Amendment of certain provisions of the Treaty
Article 12 - Safeguard of Paris and Berne Conventions
Article 13 - Reservations
Article 14 - Settlement of disputes
Article 15 - Becoming party to the Treaty
Article 16 - Entry into force of the Treaty
Article 17 - Denunciation of the Treaty
Article 18 - Texts of the Treaty
Article 19 - Depositary
Article 20 - Signature
Metadata
SiSU Metadata, document information
Manifest
SiSU Manifest, alternative outputs etc.
Treaty on Intellectual Property in respect of Integrated Circuits (Washington, 26 May 1989)
Multilateral
copy @ Lex Mercatoria
This Treaty shall be open for signature between May 26, 1989, and August 25, 1989, with the Government of the United States of America, and between August 26, 1989, and May 25, 1990, at the headquarters of WIPO.
IN WITNESS WHEREOF the undersigned, being duly authorized thereto, have signed this Treaty.
DONE AT WASHINGTON, this twenty-sixth day of May one thousand nine hundred and eighty-nine.
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